The rise and development of third-generation semiconductors have driven the continuous evolution of semiconductor power devices towards higher power, miniaturization, integration, and multifunctionality, accelerating the iterative demand for improved performance in packaging substrates.
To cater to the packaging needs of high-end substrates, Nanjing Zhongjiang New Material Technology Co., Ltd. has devoted several years to research and development, overcome numerous technical challenges, and successfully developed AMB active metal brazing copper-clad ceramic products. In August 2021, the "Research and Development Project of Large-Scale Preparation Technology for Ceramic Copper-Clad Substrate AMB Process" funded by the Science and Technology Bureau of Jiangning District, Nanjing City, and the Finance Bureau of Jiangning District, Nanjing City, was officially established. In October 2022, the project successfully passed the review and acceptance.
Currently, our company has officially launched this process into mass production. Amidst the rising momentum of the new energy market, it not only fills a gap in the industry but also presents tremendous market opportunities, bolstering the rapid development of the domestic power semiconductor industry chain!
